HiPerFET TM
Power MOSFETs
Single Die MOSFET
N-Channel Enhancement Mode
Avalanche Rated, High dv/dt, Low t rr
Preliminary data sheet
IXFN 80N48
D
G
S
S
V DSS
I D25
R DS(on)
= 480 V
= 80 A
= 45 m W
Symbol
V DSS
V DGR
V GS
Test Conditions
T J = 25 ° C to 150 ° C
T J = 25 ° C to 150 ° C; R GS = 1 M W
Continuous
Maximum Ratings
480 V
480 V
± 20 V
miniBLOC, SOT-227 B (IXFN)
E153432
S
G
V GSM
Transient
± 30
V
I D25
I DM
I AR
T C = 25 ° C, Chip capability
T C = 25 ° C, pulse width limited by T JM
T C = 25 ° C
80
320
80
A
A
A
D
S
E AR
E AS
dv/dt
T C = 25 ° C
T C = 25 ° C
I S £ I DM , di/dt £ 100 A/ m s, V DD £ V DSS ,
T J £ 150 ° C, R G = 2 W
64
6
5
mJ
J
V/ns
G = Gate D = Drain
S = Source
Either Source terminal of miniBLOC can be used
as Main or Kelvin Source
P D
T J
T JM
T stg
V ISOL
M d
Weight
Symbol
V DSS
V GH(th)
I GSS
T C = 25 ° C
50/60 Hz, RMS t = 1 min
I ISOL £ 1 mA t=1s
Mounting torque
Terminal connection torque
Test Conditions
V GS = 0 V, I D = 3 mA
V DS = V GS , I D = 8 mA
V GS = ± 20 V DC , V DS = 0
700 W
-55 ... +150 ° C
150 ° C
-55 ... +150 ° C
2500 V~
3000 V~
1.5/13 Nm/lb.in.
1.5/13 Nm/lb.in.
30 g
Characteristic Values
(T J = 25 ° C, unless otherwise specified)
min. typ. max.
480 V
2 4 V
± 200 nA
Features
? International standard packages
? miniBLOC, with Aluminium nitride
isolation
? Low R DS (on) HDMOS TM process
? Rugged polysilicon gate cell structure
? Unclamped Inductive Switching (UIS)
rated
? Low package inductance
? Fast intrinsic Rectifier
Applications
? DC-DC converters
? Battery chargers
? Switched-mode and resonant-mode
power supplies
? DC choppers
? Temperature and lighting controls
I DSS
R DS(on)
V DS = V DSS
V GS = 0 V
V GS = 10 V, I D = 0.5 ? I D25
Pulse test, t £ 300 m s,
duty cycle d £ 2 %
T J = 25 ° C
T J = 125 ° C
100
2
45
m A
mA
m W
Advantages
? Easy to mount
? Space savings
? High power density
? 2000 IXYS All rights reserved
98724 (05/31/00)
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